The position of industrial ceramics in the IC industry
IC, that is, integrated circuit, has been 70 years since the birth of the first transistor in 1947. The development of more than half a century has promoted the road to modern intelligence. The IC is mainly composed of three parts: electronic components, substrate, and package shell. What we are going to talk about today is two other categories besides electrical components-substrates and packaged tubes and shells.
The attention of these two pieces is always not as high as that of electronic components. It may be because the package and substrate seem to be very technical, but everyone may ignore the essence.
Integrated circuits, as the name suggests, are to be integrated. Perhaps a modern building can be a good analogy: there are shops, offices, canteens, and serviced apartments on the ground, there are parking lots on the ground floor, and there is a foundation under the parking lot-this is the layout of the integrated circuit.
The package and substrate are equivalent to the frame of the entire building, which is the rigid standard that determines the volume area of the IC. At present, there are only three materials for packaging and substrates: plastic, metal, and industrial ceramics. And what we are going to talk about today is industrial ceramics.
Compared with the other two materials, ceramic substrates and ceramic packages are relatively newcomers, but the popularity of industrial ceramics is far faster than that of plastics and metals. Whether in substrates or packaging, industrial ceramics have their unique and unparalleled advantages. .
At present, the power of electronic equipment is moving in the direction of no maximum and only greater. Then heat dissipation must be the first problem. If the heat dissipation problem is not solved, all ideas can only be discussed on paper. For the future of heat dissipation, industrial ceramics The king of this field, whether it is a metal substrate or a plastic substrate, the thermal conductivity is in the single digits, while the ceramic substrate can reach a thermal conductivity of 170-230.
From the point of view of thermal expansion coefficient, the ceramic substrate will also be closer to silicon, and the volume change that occurs at temperature is basically the same as that of electronic components, which will not cause problems due to thermal expansion and contraction. In the field of communication, the dielectric constant of industrial ceramics is very small, and the relative dielectric loss is also very small. Moreover, the coming of 5G will lead to the enthusiasm for ceramic substrates in the field of communication.
In the field of packaging, ceramic packaging applications are slightly wider than ceramic substrates, such as COB, CDIP, CQFP, etc., but domestic does not pay much attention to this, resulting in a large-scale recall of LED exports in 2017. No matter it is LED, it is the same in other fields. It is necessary to ensure the quality and the foundation to build a skyscraper.
IC is a very large piece. As to whether industrial ceramic materials can become a killer or replace the other two materials, it is unknown. But ceramics will dominate the IC industry.